ذكذكتسئµ

Mechanical Engineering

College of Engineering

Publications

Xuejun Fan, Ph.D.
Professor

Xuejun Fan, Ph.D.

Books

  1. van Driel WD, Fan XJ, Zhang GQ (eds.). Solid State Lighting Reliability Part 2: Components to System. Springer, New York. 2017. 
  2. van Driel WD, Fan XJ (eds.). Solid State Lighting Reliability: Components to System. Springer, New York. 2012.  
  3. Fan XJ, Suhir, E. (eds.). Moisture Sensitivity of Plastic Packages of IC devices. Springer, New York, 2010. , front matter
  4. Zhang GQ, van Driel WD, Fan XJ. Mechanics of Microelectronics. Springer, 2006.  

Videos/Tutorials

  1. (2023) Design Rules and Acceleration Model for Electromigration-Induced Failure: Coupled Modeling and Experimental Verification. 
  2. (2023) A 15-year Journey of Research on Electromigration - a keynote presentation at 2023 EuroSimE.
  3. (2022) 2-hr Tutorial: Reliability Physics and Failure Mechanisms in Electronics Packaging.   
  4. (2022) Baking Time Study for Moisture-Sensitive Packages.  
  5. (2020) Overview of the Modeling & Simulation Chapter of the Heterogeneous Integration Roadmap (HIR).  
  6. (2019) New Results on Electromigration Modeling - A departure from Blech's Theory.
  7. (2019) Reliability Mechanics and Modeling in IC Packaging: Theory, Practice and Implementation. [Slides Link]
  8. (2008) Moisture Related Reliability in Electronics Packaging, Electronic Component Technology Conference (ECTC) Short Course Notes. [Slides Link]

Papers

2023

  1. Cui Z, Fan XJ, Zhang Y, Vollebregt S, Fan JJ, Zhang GQ. Coupling Model of Electromigration and Experimental Verification – Part I: Effect of Atomic Concentration Gradient. Journal of the Mechanics and Physics of Solids. Volume 174, May 2023, 105257. 
  2. Cui Z, Fan XJ, Zhang Y, Vollebregt S, Fan J, Zhang GQ, Coupling Model of Electromigration and Experimental Verification – Part II: Impact of Thermomigration. Journal of the Mechanics and Physics of Solids. Volume 174, May 2023, 105256. 
  3. D Hu, C Qian, X Liu, L Du, Z Sun, X Fan, G Zhang, J Fan. High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling. Journal of Materials Research and Technology, 2023, 26, pp. 3183–3200
  4. Zhang, Y., Anicode, S.V.K., Fan, X., Madenci, E. Peridynamic modeling of void nucleation and growth in metal lines due to electromigration in a finite element framework. Computer Methods in Applied Mechanics and Engineering 2023, 414, 116183
  5. Jiang, J., Chen, W., Qian, Y., Meda, A.H., Fan, X., Zhang, G., Fan, J. Thermo-Mechanical Oriented Reliability Enhancement of Si MOSFET Panel-level Packaging using Ant Colony Optimization with Backpropagation Neural Network. IEEE Transactions on Components, Packaging and Manufacturing Technology. 2023 DOI: 10.1109/TCPMT.2023.3267411
  6. Zhang, Y., Anicode, S.V.K., Madenci, E., Fan, X. Fully Coupled Electromigration Modeling Using Peridynamics. Proceedings - Electronic Components and Technology Conference. 2023, 2023-May, pp. 682–688
  7. Khanal, M., Zhou, J., Fan, X. Analytical Solution for Moisture Diffusion with Initial Non-Uniform Moisture Concentration used in Bake Time Study in Electronics Packaging, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023, DOI: 10.1109/EuroSimE56861.2023.10100783
  8. Cui, Z, Fan, X., Zhang, G. Effect of Thermomigration on Electromigration in SWEAT Structures. 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. DOI: 10.1109/EuroSimE56861.2023.10100774
  9. Vellukunnel,T., Khanal, M., Fan, X. Thermal Stresses in a Bi-Layer Assembly in Electronics Packaging. 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. DOI: 10.1109/EuroSimE56861.2023.10100842
  10. Cui, Z, Fan, X, Zhang, G. Effect of Passivation and Mechanical Constraint on Electromigration in Interconnect. Proceedings - Electronic Components and Technology Conference. 2023, 2023-May, pp. 1327–1331.
  11. Minzhen Wen, Baotong Guo, Shanghuan Chen, Xiao Hu, Xuejun Fan, Guoqi Zhang, Jiajie Fan. Hydrolysis Mechanism Analysis of (Ca, Sr) AlSiN₃: Eu²⁺ Red Phosphor Aged Under Pressure Cooker Test and 85° C&85% RH Test: Kinetics Modeling and First-principles Calculation. 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

2022

  1. Yuan CA, Fan J, Fan XJ. Deep machine learning of the spectral power distribution of the LED system with multiple degradation mechanisms. Journal of Mechanics, Volume 37, 172–183, 2022.
  2. Li S, Liu Y, Ye HY, Liu X, Sun F, Fan XJ, Zhang GQ. Sintering mechanism of Ag nanoparticle-nanoflake: a molecular dynamics simulation. Journal of Materials Research and Technology. Volume 16, 640-655. 2022.
  3. Fan J; Jiang D; Zhang H; Hu D; Liu X; Fan XJ; Zhang GQ; High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging, Results in Physics 33, 105168, 2022.
  4. Cui Z; Zhang Ya; Hu D; Vollebregt S; Fan J; Fan XJ; Zhang GQ; Effects of temperature and grain size on diffusivity of aluminium: electromigration experiment and molecular dynamic simulation. Journal of Physics: Condensed Matter, 34, 17,175401, 2022
  5. Chen W; Chen Y; Cao Y; Cui Z; Fan X; Zhang GQ; Fan JJ; Sulfur-Rich Ageing Mechanism of Silicone Encapsulant Used in LED Packaging: An Experimental and Molecular Dynamic Simulation Study. Frontiers in Materials, 9, 819294, 2022.
  6. van Driel, WD; Mehr, M Yazdan; Fan, XJ; Zhang, GQ; Outlook: From Physics of Failure to Physics of Degradation. Reliability of Organic Compounds in Microelectronics and Optoelectronics., 535-538, 2022,
  7. Ye G; Fan X; Zhang GQ; Practical aspects of thermomechanical modeling in electronics packaging: A case study with a SiC power package. Microelectronics Reliability, 132, 114514, 2022.
  8. Qian C; Gu T; Wang P; Cai W; Fan X; Zhang GQ; Fan JJ; Tensile characterization and constitutive modeling of sintered nano-silver particles over a range of strain rates and temperaturas. Microelectronics Reliability. 132, 114536
  9. Ye G; Fan XJ; Middelburg LM; El Mansouri Brahim; Poelma RH; Zhang GQ; Simulation for stability of a beam-mass based high-resolution MEMS gravimeter, Materials & Design, 110788, 2022.
  10. Fan J; Qian Y; Chen W; Jiang J; Tang Z; Fan XJ; Zhang GQ; Genetic Algorithm–Assisted Design of Redistribution Layer Vias for a Fan-Out Panel-Level SiC MOSFET Power Module Packaging. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 260-265. 2022.
  11. Cui Z; Fan XJ; Zhang GQ; Implementation of Fully Coupled Electromigration Theory in COMSOL 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 233-238, 2022.
  12. Feng S; Jiang T; Chen W; Fan XJ; Zhang GQ; Fan J; Dynamic mechanical analysis of (Ca, Sr) AlSiN 3: Eu 2+ phosphor/silicone composites aged under the temperature–humidity–sulfur coupled condition. 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022.

2021

  1. Ma L, Qiu W, Fan XJ. Stress/strain characterization in electronic packaging by micro-Raman spectroscopy: A review. Microelectronics Reliability, 118, 114045, 2021.
  2. Ibrahim MS, Fan JJ, Yung WKC, Jing Z, Fan XJ, van Driel W, Zhang GQ. System level reliability assessment for high power light-emitting diode lamp based on a Bayesian network method. Measurement, 176, 109191, 2021.
  3. Fan JJ, Jing Z, Cao Y, Ibrahim MS, Li M, Fan XJ, Zhang GQ. Prognostics of radiation power degradation lifetime for ultraviolet light-emitting diodes using stochastic data-driven models, Energy and AI, 4, 100066, 2021.
  4. Cui Z, Fan XJ, Zhang GQ. Molecular dynamic study for concentration-dependent volume relaxation of vacancy. Microelectronics Reliability, 120, 114127, 2021.
  5. Yuan W, Fan JJ, Dong L, Chen S, Fan XJ, Zhang GQ. Evaluating the moisture resistance of Y3Al5O12: Ce3+ phosphor used in high power white LED packaging. Microelectronics Reliability 121, 114130. 2021.
  6. Qian Y, Hou FZ, Fan JJ, Lv Q, Fan XJ, Zhang GQ. Design of a Fan-Out Panel-Level SiC MOSFET Power Module Using Ant Colony Optimization-Back Propagation Neural Network. IEEE Transactions on Electron Devices. 3460 – 3467, 7(68), 3460 – 3467, 2021.
  7. Tang HY, Gao C, Yang H, Sacco L, Sokolovskij R, Zheng H, Ye HY, Vollebregt S, Yu HY, Fan XJ, Zhang, GQ. Room temperature ppt-level NO2 gas sensor based on SnO x/SnS nanostructures with rich oxygen vacancies, 2D Materials, 8(4), 45006, 2021.
  8. Yuan CA, Fan XJ, Zhang GQ. Solder joint reliability risk estimation by AI-assisted simulation framework with genetic algorithm to optimize the initial parameters for AI models. Materials, 14, 17, 4835. 2021.
  9. Ma LL, Zheng J, Fan XJ, Qiu W. Determination of stress components in a complex stress condition using micro-Raman spectroscopy. Optics Express, 29, 19, 30319-30326. 2021.
  10. Hu D, Gu T, Cui Z, Vollebregt S, Fan XJ,  Zhang GQ, Fan JJ. Insights into the high-sulphur aging of sintered silver nanoparticles: An experimental and ReaxFF study. Corrosion Science 192, 109846, 2021.
  11. Fan JJ, Jiang D, Zhang H, Hu, D, Liu X, Fan XJ, Zhang GQ. High-Temperature Nanoindentation Characterization of Sintered Nano-Copper Particles Used in High Power Electronics Packaging. SSRN 2021
  12. Chen LB, Fan XJ, Liu Y. Testing and Modeling of Board Level Reliability of WLCSP under UHAST Conditions  2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1329-1333,2021.
  13. Fan JJ, Gu T, Wang P, Cai W, Fan XJ, Zhang GQ. Constitutive Modeling of Sintered Nano-silver Particles: A Variable-order Fractional Model versus an Anand Model. 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

2020

  1. Yuan CA, Fan JJ, Fan XJ. deep machine learning of the spectral power distribution of the LED system with multiple degradation mechanisms. Journal of Mechanics, Volume 37, Pages 172-183. 2020.
  2. Hu D, Cui Z, Fan JJ, Fan XJ, Zhang GQ. Thermal kinetic and mechanical behaviors of pressure-assisted Cu nanoparticles sintering: A molecular dynamics study. Results in Physics, Volume 19, Pages 103486. 2020.
  3. Ibrahim MS, Fan JJ, Yung KC, Prisacaru A, van Driel W, Fan XJ, Zhang GQ. Machine Learning and Digital Twin Driven Diagnostics and Prognostics of Light‐Emitting Diodes. Laser & Photonics Reviews. Volume 14, Issue 12, Pages 2000254. 2020.
  4. Jing Z, Liu J, Ibrahim MS, Fan JJ, Fan XJ, Zhang GQ. Lifetime Prediction of Ultraviolet Light-Emitting Diodes Using a Long Short-Term Memory Recurrent Neural Network. IEEE Electron device Letters, Volume 41, Issue 12, Pages 1817-182. 2020.
  5. Fan JJ, Xu D, Zhang H, Qian C, Fan XJ, Zhang GQ. Experimental Investigation on the Sintering Kinetics of Nanosilver Particles Used in High-Power Electronic Packaging. IEEE Transactions on Components, Packaging and Manufacturing Technology. Volume 10, Issue 7. Pages 1101-1109
  6. Cui Z, Fan JJ, van Ginkel HJ, Fan XJ, Zhang GQ. The interface adhesion of CaAlSiN3: Eu2+ phosphor/silicone used in light-emitting diode packaging: A first principles study. Applied Surface Science, Volume 510, Pages 145251
  7. Fan JJ, Chen W, Yuan WY, Fan XJ, Zhang GQ. Dynamic prediction of optical and chromatic performances for a light-emitting diode array based on a thermal-electrical-spectral model. Optics Express. Volume 28, Issue 9, Pages 13921-13937.
  8. Hou FZ, Zhang HY, Huang DZ, Fan JJ, Liu FM, Lin TY, Cao LQ, Fan XJ, Ferreira B, Zhang GQ. Microchannel Thermal Management System With Two-Phase Flow for Power Electronics Over 500 W/cm2Heat Dissipation. IEEE Transactions on Power Electronics, Volume 35, Issue 10, Pages 10592-10600.
  9. Fan JJ, Zhou L, Cui Z, Chen SH, Fan XJ, Zhang GQ. Hydrolysis kinetic study of CaAlSiN3: Eu2+ red phosphor with both water immersion test and first-principles calculation. Journal of Luminescence. Volume 219. Pages 116874.
  10. Mehr MY, Bahrami A, van Driel WD, Fan XJ, Davis LJ, Zhang GQ. degradation of optical materials in solid-state lighting systems. International Materials Reviews. Volume 65, Issue 2, Pages 102-128
  11. Tang HY, Sacco LN, Vollebregt S, Ye HY, Fan XJ, Zhang GQ. Recent advances in 2D/nanostructured metal sulfide-based gas sensors: mechanisms, applications, and perspectives. Journal of Materials Chemistry A. 2020.
  12. Fan JJ, Chen SH, Sun X, Fan XJ, Zhang GQ. Hydrolytic resistant performance evaluation for Y3A15 O12: Ce3+ yellow phosphor used in white LED packaging degradation of optical materials in solid-state lighting systems. 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
  13. Liu XY, Fan XJ, Yoo J, Brake NA, Zhou J, Li XC, Sisk D. Application of 3-D CAD and 3-D Printing to RET ذكذكتسئµ to Enrich Engineering design Education. 2020 ASEE Virtual Annual Conference Content Access.
  14. Cui Z, Fan XJ, Zhang GQ. Implementation of General Coupling Model of Electromigration in ANSYS 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Pages, 1632-1637
  15. Chen L, Jiang TF, and Fan XJ, Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization. In 3D Microelectronic Packaging: From Fundamentals to Applications, Li Yan, Goyal deepak (eds), 2nd edition, Springer, 2020.

2019

  1. Fan XJ. And Lee SW. Reliability Mechanics and Modeling in IC Packaging: Theory, Practice and Implementation. Professional development Course at Electronic Packaging Technology Conference (EPTC), Singapore, December 4, 2019. Link
  2. Cui Z, Fan XJ, and Zhang GQ. General coupling model for electromigration and one-dimensional numerical solutions, Journal of Applied Physics, 125, 105101, 2019.
  3. Zhang H, Liu Y, Wang L, Sun F, Fan XJ, Zhang GQ. Indentation hardness, plasticity and initial creep properties of nanosilver sintered joint. Results in Physics, 12, 712-717, 2019.
  4. Tang HY, Li YT, Sokolovskij R, Sacco LN, Zheng H, Ye H, Yu H, Fan XJ, Tian H, Ren TL, Zhang GQ. Ultra-high sensitive NO2 gas sensor based on tunable polarity transport in CVD-WS2/IGZO pN heterojunction. ACS Applied Materials & Interfaces. 11(43), 40850-40859. 2019.
  5. Ma L, Fan XJ, Qiu W. Polarized Raman spectroscopy–stress relationship considering shear stress effect, Optics Letters, 44 (19), 4682-4685, 2019.
  6. Tang HY, Li Y, Ye H, Gao C, Tao LQ, Tu T, Gou G, Chen X, Fan XJ, Ren TL, Zhang GQ. High-performance humidity sensor using Schottky-contacted SnS nanoflakes for noncontact healthcare monitoring. Nanotechnology, 31(5), 2019.
  7. Fan JJ, Wang Z, Zhang Z, deng Z, Fan XJ, Zhang GQ. High moisture accelerated mechanical behavior degradation of phosphor/silicone composites used in white light-emitting diodes, Polymers, 11 (8), 1277, 2019.
  8. Sun B, Fan JJ, Fan XJ, Zhang GQ, Zhang GH. A Reliability Prediction Methodology for LED Arrays. IEEE Access, 7, 8127-8134, 2019.
  9. Hoque Ma, Bradley RK, Fan JJ, Fan XJ, Effects of humidity and phosphor on silicone/phosphor composite in white light-emitting diode package, Journal of Materials Science: Materials in Electronics, https://doi.org/10.1007/s10854-019-02393-8, 2019.
  10. Tang HY, Qu Z, Wang L, Ye Y, Fan XJ, Zhang GQ, Liquid-phase exfoliated SnS as a semiconductor coating filler to enhance corrosion protection performance, Physical Chemistry Chemical Physics, 21 (33), 18179-18187, 2019.
  11. Tang HY, Tan C, Yang H, Zheng K, Li Y, Ye H, Chen X, Fan XJ, Ren T, Zhang GQ, Tunable electronic and optical properties of the WS2/IGZO heterostructure via an external electric field and strain: a theoretical study, Physical Chemistry Chemical Physics, 21 (27), 14713-14721, 2019.
  12. Liu Y, Zhang H, Wang L, Fan XJ, Zhang GQ, Sun F, Stress analysis of pressure-assisted sintering for the double-side assembly of power module, Soldering & Surface Mount Technology, 31(1), 20-27, 2019.
  13. Ma L, Joshi R, Newman K, Fan XJ. Improved Finite Element Modeling of Moisture Diffusion Considering Discontinuity at Material Interfaces in Electronic Packages. 2019 IEEE 69th Electronic Components and Technology Conference (ECTC). May 28 – 31, 2019, Las Vegas, 2019.
  14. Qu Z, Tang HY, Ye H, Fan XJ, Zhang GQ, Electrical and optical characterization of MoS2 thin film transistors and the effect of strain on their performances. 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Hannover, Germany, March 24-27, 2019.
  15. Jing Z, Ibrahim MS, Fan JJ, Fan XJ, Zhang GQ. Lifetime Prediction of Ultraviolet Light-emitting Diodes with Accelerated Wiener degradation Process. 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Hannover, Germany, March 24-27, 2019.
  16. Sun B, Fan JJ, Fan XJ, Zhang GQ. A SPICE-based Transient Thermal-Electronic Model for LEDs. 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Hannover, Germany, March 24-27, 2019.

2018

  1. Zhang H, Liu Y, Wang LG, Sun FL, Fan JJ, Placette MD, Fan XJ, Zhang GQ. Effects of sintering pressure on the densification and mechanical properties of nanosilver double side sintered power module. IEEE Transactions on Components, Packaging and manufacturing Technology, 9(5), 963-972, 2018.
  2. Fan J, Cao K, Yu K, Qian C, Fan XJ, Zhang GQ, A design and qualification of LED flip Chip-on-Board module with tunable color temperatures. Microelectronics Reliability, 84, 140-148, 2018.
  3. Yang N, Yang DG, Chen LB, Liu DJ, Cai M, and Fan XJ, A novel interconnected structure of graphene-carbon nanotubes for the application of methane adsorption, IEEE Sensors, 18 (4), 1555-1561, 2018.
  4. Zhu WH, Fan XJ, Brake N, Liu XY, Li XC, Zhou J.Yoo J, SisK D. Engineering design and manufacturing education through research experience for high school teachers. Procedia manufacturing, 26, 1340-1348, 2018.
  5. Ahmed S, Karna N, Zhou J, Chu HW, Placette M, Fan XJ, Chen LB. Investigation of affecting parameters on the effective modulus and natural frequency of wavy carbon nanotubes. Journal of Physics and Chemistry of Solids, 121, 121-127, 2018.
  6. Chen LB, Zhou J, Chu HW, Zhang GQ, Fan XJ. A review on water vapor pressure model for moisture permeable material subjected to rapid heating. Applied Mechanics Review, 70 (2), 020803, 2018.
  7. Liu Y, Zhang H, Wang L, Fan XJ, Zhang GQ, Sun FL, Effect of sintering pressure on the porosity and the shear strength of the pressure-assisted silver sintering bonding. IEEE Transactions on device and materials Reliability, 18 (2), 240 – 246, 2018.
  8. Jiang C, Fan JJ, Qian C, Zhang H, Fan XJ, Guo WL, Zhang GQ. Effects of voids on mechanical and thermal properties of the die attach solder layer used in high-power LED chip-scale packages. IEEE Transactions on Components, Packaging and manufacturing Technology. 99, 1-9, 2018.
  9. Sun B, Fan XJ, van Driel W, Cui CQ, Zhang GQ. A stochastic process based reliability prediction method for LED driver. Reliability Engineering & System Safety, 178, 140-146, 2018.
  10. Yang N, Daoguo Yang DG, Zhang GQ, Chen LB, Liu DJ, Cai M, Fan XJ. The effects of graphene stacking on the performance of methane sensor: a first-principles study on the adsorption, band gap and doping of graphene. Sensors, 18(2), 422, 2018.
  11. Fan JJ, JW, Yu C, Qian C, Fan XJ, Zhang GQ. A design and qualification of LED flip Chip-on-Board module with tunable color temperatures. Microelectronics Reliability, 84, 140-148, 2018.
  12. Khalilullah I, Reza T, Chen LB, Placette M, mazumder MH AKM, Zhou J, Fan JJ, Qian C, Zhang GQ, Fan XJ. In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging. Microelectronics Reliability, 84, 208-214, 2018.
  13. Zhang H, Liu Y, Wang L, Fan JJ, Fan XJ, Sun FL, Zhang GQ New hermetic sealing method for ceramic package using nanosilver sintering technology. Microelectronics Reliability, 81, 143-149, 2018.
  14. Yang N, Yang DG, Chen L, Liu D, Cai M, Fan XJ. design and adjustment of the graphene work function via size, modification, defects, and doping: a first-principle theory study. Nanoscale Research Letters. 12: 642, 2017.
  15. Zhu WH, Fan XJ, Yoo J, SisK D, Brake N, Li XC, Liu XY, Zhou J. First year experience from RET site: incorporating engineering design and manufacturing into the high school curriculum, 2018 ASEE Annual Conference & Exposition, Salt Lake, June 23-27, 2018.
  16. Wang Z, Fan J, Liu J, Hu A, Qian C, Fan XJ, Zhang GQ. Fatigue damage assessment of LED chip scale packages with finite element simulation. 19th International Conference on Electronic Packaging Technology (ICEPT), Shanghai, 8-11 Aug. 2018.
  17. El Barbary M, Chen LB, Qin F, Liu Y, Fan XJ, On the Uniqueness and Sensitivity of Nanoindentation Testing for determining Elastic and Plastic material Properties of Electroplating Copper Filled in Through-Silicon-Via (TSV), ECTC 2018, 1023-1029, San Diego, CA. 2018.
  18. Chen LB, Liu Y, Fan XJ. Application of water activity-based theory for moisture diffusion in electronic packages using ANSYS. 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2018.
  19. Cui Z, Chen XP, Fan XJ, Zhang GQ. Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages. 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2018.

2017

  1. Yang N, Yang DG, Chen LB, Liu D, Cai M, and Fan XJ. A First-Principle Theoretical Study of Mechanical and Electronic Properties in Graphene Single-Walled Carbon Nanotube Junctions. materials, 10 (11), 2017.
  2. Lu GJ, van Driel WD, Fan XJ, Fan JJ, Qian C, Zhang GQ. Color Shift Acceleration on Mid-Power LED Packages. Microelectronics Reliability, 78, 294-298, 2017.
  3. Tang HY, Ye HY, Wong CKY, Leung YY, Fan JJ, Chen XP, Fan XJ, GQ Zhang. Overdriving Reliability of Chip Scale Packaged LEDs: Quantitatively Analyzing the Impact of Component, Microelectronics Reliability, 78, 197-204, 2017.
  4. Qian C, Fan JJ, Fang JY, Yu CH, Ren Y, Fan XJ, and Zhang GQ. Photometric and Colorimetric Assessment of LED Chip Scale Packages by Using a Step-Stress Accelerated degradation Test (SSADT) Method. materials, 10 (10), 1181. 2017.
  5. Hou FZ, Lin TY, Cao LQ, Liu FM, Li J, Fan XJ, Zhang GQ. Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package. IEEE Transactions on Components, Packaging and manufacturing Technology, 7(10), 1721 – 1728, 2017.
  6. Tang HY, Ye HY, Chen XP, Qian C, Fan XJ, Zhang GQ. Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm. IEEE Access, 16459 – 16468. 2017.
  7. Fan JJ, Zhang MN, Luo X, Qian C, Fan XJ, Ji A, Zhang GQ. Phosphor-Silicone Interaction Effects in High Power White Light Emitting Diode Packages. Journal of materials Science: materials in Electronics. 28 (23), pp 17557–17569.
  8. Chen LB, Zhou J, Chu HW, Zhang GQ, Fan XJ. Modeling Nonlinear Moisture Diffusion in Inhomogeneous Media. Microelectronics Reliability. 75 (2017) 162–170.
  9. Fan JJ, Mohamed MG, Qian C, Fan XJ, Zhang GQ and Pecht M. Color Shift Failure Prediction for Phosphor-Converted White LEDs by Modeling Features of Spectral Power Distribution with a Nonlinear Filter Approach. materials, 10 (7), 819. 2017.
  10. Qian C, Fan JJ, Fan XJ and Zhang GQ. Prediction of Lumen depreciation and Color Shift for Phosphor-converted White Light-emitting Diodes Based on A Spectral Power Distribution Analysis Method. IEEE Access, 5, 24054 - 24061. 2017.
  11. Sun B, Fan XJ, Li L, Ye HY, van Driel W and Zhang GQ. A Reliability Prediction for Integrated LED Lamp with Electrolytic Capacitor-Free Driver. IEEE Transactions on Components, Packaging and manufacturing Technology, 7(7), 1081-1088. 2017.
  12. Fan JJ, Yu C, Qian C, Fan XJ, Zhang GQ. Thermal/luminescence characterization and degradation mechanism analysis on phosphor-converted white LED chip scale packages. Microelectronics Reliability. 74, 179–185. 2017.
  13. Qian C, Li Y, Fan JJ, Fan XJ, Fu J, Zhao L, Zhang GQ. Studies of the light output properties for a GaN based blue LED using an electro-optical simulation method. Microelectronics Reliability. 74, 173–178. 2017.
  14. Sun B, Fan XJ, Ye HY, Fan JJ, Qian C, van Driel WD, Zhang GQ. A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation. Reliability Engineering and System Safety. Reliability Engineering and System Safety 163, 14–21. 2017.
  15. Kijkanjanapaiboon K, Xie M, Zhou J, Fan XJ. Investigation of Dimensional and Heat Source Effects in Lock-In Thermography Applications in Semiconductor Packages. Applied Thermal Engineering 113 (2017) 673–683.
  16. Qian C, Fan JJ, Fan XJ and Zhang GQ. Advances in Reliability Testing and Standards development for LED Packages and Systems. In Solid State Lighting Reliability Part 2: Components to Systems. 77-114. Springer, New York. 2017. 
  17. Lu GJ, van Driel WD, Fan XJ, Fan JJ, Zhang GQ. LED based Luminaire Color Shift Acceleration and Prediction. In Solid State Lighting Reliability Part 2: Components to Systems. 201-219. Springer, New York. 2017.
  18. Fan JJ, Qian C, Fan XJ, Zhang GQ and Pecht M. Fault Diagnostics and Lifetime Prognostics for Phosphor-Converted White LED Packages. In Solid State Lighting Reliability Part 2: Components to Systems. 255-299. Springer, New York. 2017.
  19. Huang JL, Golubović DS, Koh S, Yang DG, Li XP, Fan XJ and Zhang GQ. degradation Mechanisms of Mid-power White-light LEDs. In Solid State Lighting Reliability Part 2: Components to Systems. 381-432. Springer, New York. 2017.
  20. Sun B, Fan XJ, van Driel WD, Zhang GQ. Reliability Prediction of Integrated LED Lamps with Electrolytic Capacitor-less LED Drivers. In Solid State Lighting Reliability Part 2: Components to Systems. 455-486. Springer, New York. 2017.
  21. Chen L, Jiang TF, and Fan XJ, Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization. In 3D Microelectronic Packaging: From Fundamentals to Applications, Li Yan, Goyal deepak (eds), 293-332. Springer, 2017.
  22. Fan JJ, Xie CY, Qian C, Fan XJ, Zhang GQ. Luminescence Mechanism Analysis on High Power Tunable Color Temperature Chip-on-Board White LED Modules. 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Dresden, Germany. 2-5 April 2017.
  23. Luo X, Fan JJ, Zhang MN, Qian C, Fan XJ, Zhang GQ. degradation Mechanism Analysis for Phosphor/Silicone Composites Aged Under High Temperature and High Humidity Condition. 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin, 16-19 Aug. 2017.
  24. Yu CH, Fan JJ, Qian C, Fan XJ, Zhang GQ. Luminous Flux Modeling for High Power LED Automotive Headlamp Module. 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin, 16-19 Aug. 2017.
  25. Jiang CS, Guo WL, Fan JJ, Qian C, Fan XJ, Zhang GQ. Optimization of Reflow Soldering Process for White LED Chip-Scale-Packages on Substrate. 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin, 16-19 Aug. 2017.
  26. Fan JJ, Jiang CS, Zhou J, Qian C, Fan XJ, Zhang GQ and Pecht M. Fatigue Damage Assessment of LED Chip Scale Packages with Finite Element Simulation. The International Conference on Advances in Computational Mechanics. 2017.
  27. Qian C, Luo L, Fan JJ, Li XQ, Fan XJ, Zhang GQ. Effects of Phosphor Dispersion on Optical Characteristics of LED Chip Scale Package LEDs. 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Dresden, Germany. 2-5 April 2017.
  28. Sun B, Fan XJ, Fan JJ, Qian C, Zhang GQ. A PoF and Statistics Combined Reliability Prediction for LED Arrays in Lamps. 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Dresden, Germany. 2-5 April 2017.
  29. Khalilullah I, Reza T, Chen LB, mazumder AKM, Fan JJ, Qian C, Zhang GQ, Fan XJ. In-Situ Characterization of Moisture Absorption and Hygroscopic Swelling of Silicone/Phosphor Composite Film and Epoxy Mold Compound in LED Packaging. 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Dresden, Germany. 2-5 April 2017.
  30. Tang HY, Ye HY, Chen XP, Fan XJ, Zhang GQ. Thermal conductivity of functionalized graphene-polymer nanocomposite: A non-equilibrium molecular dynamics study, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Dresden, Germany. 2-5 April 2017.
  31. ma R, Qin F, Fan JJ, Fan XJ, Qian C, Electromigration simulation of flip chip CSP LED, 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin, 16-19 Aug. 2017.
  32. Chen LB, Zhou J, Chu HW, Fan XJ. A Unified and Versatile Model Study for Moisture Diffusion. 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, Florida. 30 may-2 June 2017.

2016

  1. Lu GJ, van Driel WD, Fan XJ, Mehr, MY, Fan JJ, Qian C, Jansen KMB, Zhang GQ, Color shift and mechanism investigation on the PMma diffuser used in LED-based luminaires. Optical materials. 54, 282–287, 2016.
  2. Huang JL, Golubovićb DS, Koh S, Yang DG, Lie XP, Fan XJ, Zhang GQ.  Lumen degradation modeling of white-light LEDs in step stress accelerated degradation test. Reliability Engineering & System Safety. 154, 152–159. 2016.
  3. Sun B, Fan XJ , Qian C, Zhang GQ. PoF-Simulation-Assisted Reliability Prediction for Electrolytic Capacitor in LED Drivers.  IEEE Transactions on Industrial Electronics, 63(11), 6726 - 6735. 2016.
  4. Shen Y, Zhang L. Zhu WH, Zhou J, Fan XJ. Finite-element analysis and experimental test for a capped-die flip-chip package design, IEEE Transactions on Components, Packaging and manufacturing Technology.  6(9), 1308 – 1316. 2016.
  5. Ye HY, Leung YY, Wong KY, Lin K, Chen XP, Fan JJ, Kjelstrup S, Fan XJ, Zhang GQ. Thermal Inductance in GaN devices. IEEE Electron device Letters, 37 (11), 1473 – 1476, 2016.
  6. Qian C, Fan XJ, Yuan C, Zhang GQ. An accelerated test method of luminous flux depreciation for LED luminaires and lamps, Reliability Engineering & System Safety. Volume 147, 84–92. 2016.
  7. Ou ZC, Yao XH, Zhang XQ, Fan XJ. Dynamic stability of flexible electronic structures under step loads. European Journal of Mechanics A: Solids 58, 247-255. 2016.
  8. Poelma RH, Fan XJ, Hu ZY, van Tendeloo G, van Zeijl HW, Zhang GQ, Effects of nanostructure and coating on the mechanics of carbon nanotube arrays, Advanced Functional materials, 26(8), 1233-1242. 2016.
  9. Chen L, Adams J, Chu HW, Fan XJ. Modeling of moisture over-saturation and vapor pressure in die-attach film for stacked-die chip scale packages, Journal of materials Science: materials in Electronics, 27(1), pp 481-488. 2016.
  10. Ou ZC, Yao XH, Zhang XQ, Fan XJ. Buckling of a stiff thin film on a compliant substrate under anisotropic biaxial prestrain. Science China Physics, Mechanics & Astronomy. 59:624601. 2016.
  11. Cai M, Yang DG, Tian KM, Chen WB, Zhang P, Fan XJ, Zhang GQ. A hybrid prediction method on luminous flux maintenance of high-power LED lamps. Applied Thermal Engineering, 95(25), 482–490. 2016.
  12. Chen XP, Ye HY, Fan XJ, Ren TL, Zhang GQ, A review of small heat pipes for electronics, Applied Thermal Engineering, 96(5), 1-17. 2016.
  13. Kijkanjanapaiboon K, Xie M, Fan XJ.  Investigation of geometry, frequency and material's effects in lock-in thermography applications in semiconductor packages, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 31 may-3 June 2016.
  14. Fan JJ, Qian C, Zhang M, Li Y, Fan XJ, Zhang GQ.  Thermal, optical and electrical analysis on phosphor-converted white LED Chip Scale Packages with both experiment and simulation, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),  18-20 April 2016.
  15. Zhang M, Fan JJ, Qian Cheng, Fan X, Ji A, Zhang GQ. Analysis of photoluminescence mechanisms and thermal quenching effects for multicolor phosphor films used in high color rendering white LEDs. 17th International Conference on Electronic Packaging Technology (ICEPT), 2016. 16-19 Aug. 2016.
  16. Sun B, Fan XJ, van Driel WD, Michel T, Zhou J,  Zhang GQ, Lumen decay prediction in LED lamps, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),  18-20 April 2016.
  17. Qian C, Li Y, Fan JJ, Fan XJ, Fu JJ, Zhao LX, Zhang GQ.  Electro-optical simulation of a GaN based blue LED chip, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 18-20 April 2016.
  18. Tang HY, Ye HY, Wang MM, Fan XJ, Zhang GQ. Thermal analysis and optimization of IGBT power electronic module based on layout model. 17th International Conference on Electronic Packaging Technology (ICEPT), 2016. 16-19 Aug. 2016.
  19. Sun B, Fan XJ, van Driel WD , Zhang GQ. A systematic approach for reliability assessment of electrolytic capacitor-free LED drivers. 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 18-20 April 2016.
  20. Poelma RH, Fan XJ, Schlangen E, van Zeijl ZH, Zhang GQ. Tailoring material properties for 3D microfabrication: In-situ experimentation and multi-scale modelling. 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 18-20 April 2016.

2015

  1. Huang JL, Golubovićb DS, Koh S, Yang DG, Li XP, Fan XJ, Zhang GQ. Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests, Microelectronics Reliability, 55 (12), Part B, 2654–2662, 2015.
  2. Huang JL, Golubović DS, Koh S, Yang DG, Li XP, Fan XJ, and Zhang GQ, degradation modeling of mid-power white-light LEDs by using Wiener process, Optical Express. vol. 23, no. 15, pp. A966-A978. 2015.
  3. Huang JL, Golubovic DS, Koh S, Yang DG, Li XP, Fan XJ, Zhang GQ. Rapid degradation of mid-power white-light LEDs in saturated moisture conditions. , IEEE Transactions on device and materials Reliability. vol. 15, no. 4, pp. 478 – 485, 2015.
  4. Huang JL, Golubović DS, Koh S, Yang DG, Li XP, Fan XJ, and Zhang GQ, degradation mechanisms of mid-power white-light LEDs under high temperature-humidity conditions, IEEE Transactions on device and materials Reliability. vol. 15, no. 2, pp. 220–228. 2015.
  5. Fan JJ, Qian C, Yung KC, Fan XJ, Zhang GQ, Pecht M. Optimal design of life testing for high-brightness white LEDs using the six sigma DmaIC approach, IEEE Transactions on device and materials Reliability. vol. 15, no. 4, pp. 576 - 587. 2015.
  6. Chen L, Chu HW, Fan XJ, A convection-diffusion porous media model for moisture transport in polymer composites: model development and validation. Journal of Polymer Science Part B: Polymer Physics. DOI: 10.1002/polb.23784. 53, 1440–1449. 2015.
  7. Fan XJ, L Chen, Wong CP, Chu HS, Zhang GQ, Effects of vapor pressure and super-hydrophobic nanocomposite coating on microelectronics reliability. Engineering, 1(3): 384–390, 2015.
  8. Lu GJ, van Driel WD, Fan XJ, Mehr MY, Fan JJ, Jansen KMB, Zhang GQ, degradation of Microcellular PET reflective materials used in LED-based products. Optical materials, 49, 79–84, 2015.
  9. Lu GJ, Mehr MY, van Driel WD, Fan XJ, Fan JJ, Jansen KMB, and Zhang GQ, Color shift investigations for LED secondary optical designs: comparison between BPA-PC and PMma, Optical materials. vol. 45, pp. 37–41, 2015.
  10. Shen Y, L Zhang, Fan XJ. Achieving warpage-free packaging: A capped-die flip chip package design. Proc. of Electronic Components and Technology Conference (ECTC), San Diego, CA. may 26 –29, 1546 - 1552. 2015. PDF
  11. Adams J, Chen L, Fan XJ. Vapor pressure prediction for stacked-chip packages in reflow by convection-diffusion model. Proc. 12th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems. 2015. PDF
  12. Fan JJ, Qian C, Fan XJ, Zhang GQ, Pecht M. In-situ monitoring and anomaly detection for LED packages using a mahalanobis distance approach, 2015 First International Conference on  Reliability Systems Engineering (ICRSE), 21-23 Oct. 2015, Beijing, China. DOI 10.1109/ICRSE.2015.7366493, pp.6. 2015.
  13. Qian C, Fan JJ, Zhong L, Fan XJ, Zhang GQ, Li JM.Prediction of a statistical distribution of luminous flux for LED modules with an analytical model. 2015 First International Conference on Reliability Systems Engineering (ICRSE), 21-23 Oct. 2015, Beijing, China. DOI10.1109/ICRSE.2015.7366412, pp.4. 2015.
  14. Lu GJ,  van Driel WD, Fan XJ,  Mehr MY, Fan JJ, Qian  C, Zhang GQ. A POF based breakdown method for LED lighting color shift reliability,  2015 12th China International Forum on  Solid State Lighting (SSLCHINA), Guangzhou, China, 2-4 Nov. 2015, p. 59-62. 10.1109/SSLCHINA.2015.7360689.
  15. Mengni Zhang, Fan JJ, Qian C, Li Y, Fan XJ, Ji AM, Zhang GQ. Investigation of photoluminescence and thermal effect of phosphor films used in phosphor-converted white LEDs, , 2015 12th China International Forum on  Solid State Lighting (SSLCHINA), Guangzhou, China, 2-4 Nov. 2015, p. 59-62. 10.1109/SSLCHINA.2015.7360688. 2015.
  16. Ye HY, Tang HY,  Leung S, Qian C, Fan XJ, Zhang GQ.  Junction temperature measurement to optimize thermal design of LED arrays. 2015 12th China International Forum on  Solid State Lighting (SSLCHINA), Guangzhou, China, 2-4 Nov. 2015, p. 47-51. 10.1109/SSLCHINA.2015.7360687. 2015.
  17. Kijkanjanapaiboon K, Kretschmer TW, Chen L, Fan XJ, and  Zhou J. LED’s luminous flux lifetime prediction using a hybrid numerical approach, Proc. 12th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems. 2015 PDF
  18. Sun B, Fan XJ,   Yuan CA, Qian C, Zhang GQ, A degradation model of aluminum electrolytic capacitors for LED drivers. Proc. 12th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems. 2015.

2014

  1. Ou ZC, Yao XH, Zhang XQ, Fan XJ. Computers, materials & Continua, vol.44, no.3, pp.205-221, 2014. PDF
  2. Zhu LS, Zhou J, Fan XJ. Rupture and instability of soft films due to moisture vaporization in microelectronic devices. Computers, materials & Continua, vol.39, no.2, pp.113-134, 2014.
  3. Poelma RH, Morana B, Vollebregt S, Schlangen E, van Zeijl HW, Fan XJ, Zhang GQ. Tailoring the mechanical properties of high-aspect-ratio carbon nanotube arrays using amorphous silicon carbide coatings. Advanced Functional materials. DOI: 10.1002/adfm.201400693, Volume 24, Issue 36, 5737–5744. 2014. 
  4. Taner O, Kijkanjanapaiboon K, and Fan XJ. Does Current Crowding Induce Vacancy Concentration Singularity in Electromigration?. Proc. of Electronic Components and Technology Conference (ECTC), Lake BuenaVista, Florida. may 27 –30, 967-972. 2014. PDF
  5. Sun B, Fan XJ, Yuan CA, Koh SW, Zhang GQ. A lifetime prediction method for solid state lighting power converters based on SPICE models and finite element thermal simulations. Proc. 15th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2014), Gent, Belgium. 2014. PDF
  6. Lu GJ, Yuan CA, Fan XJ, Zhang GQ. Correlation of activation energy between LEDs and luminaires in the lumen depreciation test. 15th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2014), Gent, Belgium. 2014. PDF
  7. Fan XJ, Pei M, Bhatti PK. Thermal stresses in flip chip BGA packaging. in Encyclopedia of Thermal Stresses. R.B. Hetnarski (ed.), Encyclopedia of Thermal Stresses, DOI 10.1007/978-94-007-2739-7, 5344-5369. Springer Science+Business Media Dordrecht 2014. 
  8. Fan XJ. Thermal stresses in wafer level packaging. in Encyclopedia of Thermal Stresses. R.B. Hetnarski (ed.), Encyclopedia of Thermal Stresses, DOI 10.1007/978-94-007-2739-7, 5415-5432. Springer Science+Business Media Dordrecht 2014. 

2013

  1. Zhou T and Fan XJ. Effect of system design and test conditions on wafer level package drop test reliability. SMTA International. October 2013. PDF
  2. Sun B, Yuan CA, Fan XJ, Koh SW, Zhang GQ. An accelerated lifetime test method for DC or AC supplied electronic control gear for LED modules of outdoor LED lighting products. Proceedings of China Solid State Lighting Forum, 2013.
  3. Lu GJ, Yuan C, Tang H, Wong C, Fan XJ, Zhang GQ. Cause analysis on highly depreciated indoor LED product in CSA020. Proceedings of China Solid State Lighting Forum, 2013.
  4. Tang HY, Li DH, Pan M, Yang T, Yuan C, Fan XJ. Thermal analysis and optimization design of LED streetlight module. Proceedings of China Solid State Lighting Forum, 2013.
  5. Lu GJ, Yuan C, Sun B, Li B, Fan XJ, Zhang GQ. Validation of the methodology of lumen depreciation acceleration of LED lighting. Proceedings of China Solid State Lighting Forum, 2013.
  6. Zheng J. Fan XJ, Zhang GQ. ذكذكتسئµ semiconductor lighting technology development in China and the world in last ten years (in Chinese). China Dream of Semiconductor Lighting (ed. Wu L). Chemical Industry Press (China). 2013.
  7. Fan XJ, Yuan C. Effect of temperature gradient on moisture diffusion in high power devices and the applications in LED packages. Proc. of Electronic Components and Technology Conference (ECTC), Las Vegas, Nevada. may 28 -31, 1466-1470. 2013. PDF
  8. Fan XJ. Multi-physics modeling in IC packaging and microsystems. Electronic Components and Technology Conference (ECTC), PDC course notes, Las Vegas, Nevada. may 28 -31, 2013.
  9. Koh SW, Yuan CA, Sun B, Li B, Fan XJ, Zhang GQ. Product level accelerated lifetime test for indoor LED luminaires. Proc. 14th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2013), Wrosclaw, Poland. 2013. PDF
  10. Cai M, Tian KM, Chen WB, Huang H, Tang HY, Liang LL, Yang DG, Fan XJ, Zhang GQ. A novel hybrid method for reliability prediction of high-power LED luminaires. Proc. 14th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2013), Wrosclaw, Poland. 2013. PDF
  11. Sun B, Koh SW, Yuan CA, Fan XJ, Zhang GQ. Accelerated lifetime test for isolated components in linear drivers of high-voltage LED system. Proc. 14th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2013), Wrosclaw, Poland. 2013. PDF
  12. Fan XJ, Ranouta AS, Dhiman HS. Effects of package level structure and material properties on solder joint reliability under impact loading. IEEE Transactions on Components, Packaging and manufacturing Technology. 3(1), 52-60. 2013. PDF

2012

  1. Fan XJ, Ranouta AS. Finite element modeling of system design and testing conditions for component solder ball reliability under impact. IEEE Transactions on Components, Packaging and manufacturing Technology. 2(11), 1802-1810, 2012. PDF
  2. Youssef AH, Fan XJ. Dynamic analysis of bare printed circuit board under impact. Proc. of International Conference on Electronic Packaging Technology and High density Packaging (ICEPT-HDP). Guilin, China, August 13-17, 2012. PDF
  3. Placette MD, Fan XJ, Zhao JH, Edwards D. Dual stage modeling of moisture absorption and desorption in epoxy mold compounds. Microelectronics Reliability 52, 1401–1408. 2012. PDF
  4. Zhang Y, Liu Y, Liang L, Fan XJ. The effect of atomic density gradient in electromigration. International Journal of materials and Structural Integrity, 6(1), 36-53. 2012. PDF
  5. Fan XJ, Nagaraj V. Finite element modeling of anomalous moisture diffusion with dual stage model. Proc. of Electronic Components and Technology Conference (ECTC), San Diego, California. may 29 -June 1, 2012. PDF
  6. Fan XJ. Multi-physics modeling in IC packaging and microsystems. Electronic Components and Technology Conference (ECTC), PDC course notes, San Diego, California. may 29 -June 1, 2012.
  7. Fan XJ, Nagaraj. In-situ moisture desorption characterization of epoxy mold compound. Proc. 13th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2012). April 16-18, 2012, Lisbon, Portugal. Pp.6. PDF
  8. Fan XJ. Wafer level system packaging and integration for solid state lighting (SSL). Proc. 13th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2012). April 16-18, 2012, Lisbon, Portugal. Pp.6.
  9. Huang R, Tan YY, Walter J, Pape H, Fan XJ, Koerner H. Simulation of diffusion controlled intermetallic formation of Au/Al interface. Proc. 13th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2012). April 16-18, 2012, Lisbon, Portugal. Pp.7. PDF
  10. Carl M, Guy D, Leyendecker B, Miller A, Fan XJ. The Theoretical and experimental investigations of the heat transfer process of an automobile radiator. 2012 ASEE Gulf Southwest Annual Conference, April 4-6, 2012. El Paso, Texas. p128. PDF

2011

  1. Huang, H., Han Q., Feng N., and Fan, X.J. 2011. Buckling of functionally graded cylindrical shells under combined loads. Mechanics of Advanced materials and Structures, 18:337–346, 2011. p.337-346. PDF
  2. Ranouta, A.S. and Fan, X.J. Investigations of solder ball drop reliability: BGA versus WLP. Proc. of 2011 International Conference on Electronic Packaging Technology and High density Packaging (ICEPT-HDP). Shanghai, China, August 8-11, 2011. p.626-631. PDF
  3. Placette, M.D., Fan, X.J.; Zhao, J.H.; and Edwards, D. 2011. A dual stage model of anomalous moisture diffusion and desorption in epoxy mold compounds. Proc. 12th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2011). April 18-20, 2011, Linz, Austria. Pp.8. PDF
  4. Fan, X.J. and Zhao, J.H. 2011. Moisture diffusion and integrated stress analysis in encapsulated microelectronics devices. Proc. 12th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2011). April 18-20, 2011, Linz, Austria. Pp.8.
  5. Fan, X.J. 2011. Multiphysics Modeling of Microelectronics Packaging and Microsystems. Short Course Notes. 12th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2011). April 17, 2011, Linz, Austria.
  6. Varia, R. and Fan, X.J. 2011. Reliability enhancement of wafer level packages with nano-column-like hollow solder ball structures. Proc of 61st Electronic Components and Technology Conference (61st ECTC), Orlando, Florida. may 31 – June 3, 2011. p.754-760.
  7. Dandu, P. and Fan, X.J. 2011. Assessment of current density singularity in electromigration of solder bumps. Proc of 61st Electronic Components and Technology Conference (61st ECTC), Orlando, Florida. may 31 – June 3, 2011. p.2192-2196. PDF
  8. Fan, X.J. 2011. Moisture Related Reliability in Electronic Packaging, Professional development Course Notes. 61st Electronic Components and Technology Conference (61st ECTC), Orlando, Florida. may 31 – June 3, 2011.

2010

  1. Dandu, P., Fan, X.J., Liu, Y. and Diao, C. 2010. Finite element modeling on electromigration of solder joints in wafer level packages, Microelectronics Reliability, 50, 547–555. PDF
  2. Fan, X.J., Varia, B., Han, Q., 2010. design and optimization of thermo-mechanical reliability in wafer level packaging, Microelectronics Reliability, 50, 536–546.
  3. Tee, T.Y., Fan, X.J., Lai, Y.S. 2010. Advances in Wafer Level Packaging (WLP), Guest Editorial, Microelectronics Reliability, 50, 479-480. PDF
  4. Babin, ba, Gilzow, G., Guerrero-Gonzalez, L. and Fan, X.J. 2010. Multiple heat transfer processes of a tea brewing system: theoretical and experimental investigations. Proceedings of the 2010 ASEE Gulf-Southwest Annual Conference, McNeese State University, UG-05. PDF
  5. Fan, X.J. 2010. Wafer level packaging (WLP): fan-in, fan-out and three-dimensional integration. 11th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2010). April 25-18, 2010, Bordeaux, France. PDF
  6. Dandu, P., Fan, X.J. and Liu, Y. 2010. Some remarks on finite element modeling of electromigration in solder joints. Proc of 60th Electronic Components and Technology Conference (60th  ECTC), Las Vegas, NV, USA, 396-402. PDF
  7. Fan, X.J. 2010. Moisture Related Reliability in Electronic Packaging. Professional development Course (PDC) Handouts, 60th Electronic Components and Technology Conference (60th  ECTC), Las Vegas, NV, USA.
  8. Fan, X.J. and S.W.R. Lee. 2010. Fundamental characteristics of moisture transport, diffusion, and the moisture-induced damages in polymeric materials in electronic packaging, in Moisture Sensitivity of Plastic Packages of IC devices, Fan, X.J. and Suhir, E. (eds), Chapter 1, 1-28, Springer, New York. 
  9. He, Y. and Fan, X.J. 2010. Real-time characterization of moisture absorption and desorption.  in Moisture Sensitivity of Plastic Packages of IC devices, Fan, X.J. and Suhir, E. (eds), Chapter 3, 71-89, Springer, New York. 
  10. Fan, X.J., Tee, T.Y., Shi, X.Q., and Xie, B. 2010. Modeling of moisture diffusion and whole-field vapor pressure in plastic packages of IC devices, in Moisture Sensitivity of Plastic Packages of IC devices, Fan, X.J. and Suhir, E. (eds), Chapter 4, 91-112, Springer, New York. 
  11. Shi, X.Q., Fan, X.J., Zhang, Y.L. and Zhou, W. 2010. Characterization of interfacial hydrothermal strength of sandwiched assembly using photomechanics measurement techniques, in Moisture Sensitivity of Plastic Packages of IC devices, Fan, X.J. and Suhir, E. (eds), Chapter 6, 131-151, Springer, New York.
  12. Zhou, J, Tee, T.Y., and Fan, X.J. 2010. Hygroscopic swelling of polymeric materials in electronic packaging: characterization and analysis, in Moisture Sensitivity of Plastic Packages of IC devices, Fan, X.J. and Suhir, E. (eds), Chapter 7, 153-179, Springer, New York. 
  13. Suhir, E. and Fan, X.J. 2010. Failure criterion for moisture-sensitive plastic packages of integrated circuit (IC) devices: application and extension of the theory of thin plates of large deflections, in Moisture Sensitivity of Plastic Packages of IC devices, Fan, X.J. and Suhir, E. (eds), Chapter 10, 245-278, Springer, New York. 
  14. Fan, X.J., Zhou, J., Zhang, G..Q., and Chandra, A. 2010. Continuum theory in moisture-induced failures of encapsulated IC devices, in Moisture Sensitivity of Plastic Packages of IC devices, Fan, X.J. and Suhir, E. (eds), Chapter 11, 279-299, Springer, New York. 
  15. Xie, B., Fan, X.J. and Shi, X.Q. 2010. New method for equivalent acceleration of IPC/JEDEC moisture sensitivity levels, in Moisture Sensitivity of Plastic Packages of IC devices, Fan, X.J. and Suhir, E. (eds), Chapter 13, 333-358, Springer, New York. 
  16. Zhang, M.S., Lee, S.W.R., and Fan, X.J. 2010. Hygrothermal delamination analysis of Quad Flat No-Lead (QFN) packages, in Moisture Sensitivity of Plastic Packages of IC devices, Fan, X.J. and Suhir, E. (eds), Chapter 15, 389-409, Springer, New York. 
  17. Fan, X.J., Tee, T.Y., Cui, C.Q., and Zhang, G.Q. 2010. Underfill selection against moisture in flip chip BGA packages, in Moisture Sensitivity of Plastic Packages of IC devices, Fan, X.J. and Suhir, E. (eds), Chapter 17, 435-460, Springer, New York. 
  18. Shi, X.Q., Fan, X.J. and Xie, B. 2010. Moisture sensitivity investigations of 3D stacked-die chip-scale packages (SCSPs), in Moisture Sensitivity of Plastic Packages of IC devices, Fan, X.J. and Suhir, E. (eds), Chapter 18, 461-478, Springer, New York. 

2009

  1. White, R., Seamen, J., Fan, X.J., Corder, P.R., 2009. Improved lawnmower blade design and optimization, ASME Proceedings of IMECE2009, 2009 ASME International Mechanical Engineering Congress and Exposition, IMECE2009-11564.
  2. Seamen, J., White, R., Fan, X.J., 2009. Thermal stress analysis of a lawnmower blade design, ASME Proceedings of IMECE2009, 2009 ASME International Mechanical Engineering Congress and Exposition, IMECE2009-11611.
  3. Xie, B., Fan, X.J., Shi, X.Q., Ding, H., 2009. Direct concentration approach of moisture diffusion and whole field vapor pressure modeling for reflow process: part I – theory and numerical implementation, ASME Journal of Electronic Packaging, 131(3), 031010, doi:10.1115/1.3144147. PDF
  4. Xie, B., Fan, X.J., Shi, X.Q., Ding, H., 2009. Direct concentration approach of moisture diffusion and whole field vapor pressure modeling for reflow process: part II – application to 3-D ultra-thin stacked-die chip scale packages, 131(3), 031011, doi:10.1115/1.3144154. PDF
  5. Varia, B., Fan, X.J., Han, Q., 2009. Effects of design, structure and material on thermal-mechanical reliability of large array wafer level packages, ICEPT-HDP. PDF
  6. Ranouta1, A.S., Fan, X.J., Han, Q., 2009, Shock performance study of solder joints in wafer level packages, ICEPT-HDP. PDF
  7. Zhou, T., derk, R., Rahim, K., Fan, X.J., 2009. Larger array fine pitch wafer level package drop test reliability, InterPack, IPACK2009-89018. PDF
  8. Rahim, M.S.K., Zhou, T., Fan, X.J., Rupp, G., 2009. Board level temperature cycling study of large array wafer level packages, Proc of Electronic Components and Technology Conference (59th ECTC), 898-902. PDF
  9. Dhiman, H., Fan, X.J., Zhou, T., 2009. JEDEC board drop test simulation for wafer level packages (WLPs), Proc of Electronic Components and Technology Conference (59th ECTC), 556-564. PDF
  10. Fan, X.J., Lee, S.W.R., Han, Q., 2009. Experimental investigations and model study of moisture behaviors in polymeric materials, Microelectronics Reliability, 49, 861–871. PDF
  11. Fan, X.J., and Liu, Y., 2009. design, Reliability and Electromigration in Chip Scale Wafer Level Packaging, ECTC Course Note.
  12. Fan, X.J., and Liu, Y., 2009. design, Reliability and Electromigration in Chip Scale Wafer Level Packaging, ECTC Course Note.
  13. Sathyanarayana, B.S, Srinivasan, M.N., Fan, X.J., 2009. On experimental facilities to assist modeling of elastic behavior of carbon nanotube polymer composites, American Society for Engineering Education-Gulf Southeast Conference (ASEE-GSW).

2008

  1. Fan, X.J., Zhang, G.Q., van Driel, W.D., Ernst, L.J., 2008. Interfacial delamination mechanisms during reflow with moisture preconditioning, IEEE Transactions on Components and Packaging Technologies, 31(2), 252-259. PDF
  2. van Driel, W.D., van Gils, maJ, Fan, X.J., Zhang, G..Q., Ernst, L.J., 2008. Driving mechanisms of delamination related reliability problems in exposed pad packages, IEEE Transactions on Components and Packaging Technologies, 31(2), 260-268. PDF
  3. Fan, X.J., Chandra, A., 2008. Foreword on cracking and delamination, IEEE Transactions on Components and Packaging Technologies, 31(2), 243-244. PDF
  4. Shi, X.Q., Zhang, Y.L., Zhou, W., Fan, X.J., 2008. Effect of hygrothermal aging on interfacial reliability of silicon/underfill/FR-4 assembly, IEEE Transactions on Components and Packaging Technologies, 31(1), 94-103. PDF
  5. Fan, X.J., 2008. Moisture Related Reliability in Electronic Packging, Electronic Component Technology Conference (ECTC) Short Course Notes. PDF
  6. Fan, X.J., Han, Q., 2008. design and reliability in wafer-level packaging, Proc of IEEE 10th Electronics Packaging Technology Conference (EPTC), 1-8.
  7. Fan, X.J., 2008. Mechanics of moisture for polymers: fundamental concepts and model study, Proc of the International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 159–172. PDF
  8. Fan. X.J., Zhou, J., Chandra A., 2008. Package structural integrity analysis considering moisture, Proc of Electronic Components and Technology Conference (58th  ECTC), 1054-1066. PDF
  9. Shi, X.Q., Fan, X.J., Xie, B., 2008. A new method for equivalent acceleration of JEDEC moisture sensitivity levels, Proc. of Electronics Components and Technology Conference (ECTC), 907-912. PDF
  10. Shirangi, M.H., Fan, X.J., Michel B., 2008. Mechanism of moisture diffusion, hygroscopic swelling and adhesion degradation in epoxy molding compounds, Proc. of 41st International Symposium on Microelectronics (ImaPS), 917-923. PDF
  11. Zhang, M.S., Lee, S.W.R., Fan, X.J., 2008. Stress analysis of hygrothermal delamination of quad flat no-lead (QFN) packages, ASME International Mechanical Engineering Congress and Exposition, IMECE2008-68110. PDF
  12. Dhiman, H.S., Fan, X.J., Zhou, T., 2008.  Modeling techniques for board level drop test for a wafer-level package, Proc. of International Conference on Electronic Packaging Technology and High density Packaging (ICEPT-HDP). PDF
  13. Vasudevan, V., Fan., X.J., 2008. An acceleration model for lead-free (SAC) solder joint reliability under thermal cycling, Proc of Electronic Components and Technology Conference (58th  ECTC), 139-145. PDF
  14. Fan, X.J., Han, Q., 2008. design consideration and reliability challenges in wafer-level packaging, 2008, Proc. of International Conference on Electronic Packaging Technology and High density Packaging (ICEPT-HDP). PDF
  15. Fan, X.J., Aung, K., X. Li, 2008. Investigation of thermal performance of various power-device packages, Proc. of  the International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, (EuroSimE), 691-698. PDF
  16. Fan, X.J., 2008. Moisture Sensitivity of Plastic Packages of Electronic devices. EuroSimE Short Course.

2007

  1. van Gils, maJ., van Driel, W.D., Zhang, G.Q., Bressers H.J.L., van Silfhout, R.B.R., Fan, X.J., Janssen, J.H.J., 2007. Virtual qualification of moisture induced failures of advanced packages, Journal of Microelectronics Reliability, 47(2-3), 273-279.
  2. Vasudevan, V., Fan, X., Liu, T., Young, D., 2007. Slow cycle fatigue creep performance of Pb-Free (LF) solders, Proc of Electronic Components and Technology Conference (ECTC), 116-123. PDF
  3. He, Y., Fan, X.J., 2007. In-situ characterization of moisture absorption and desorption in a thin BT core substrate, Proc. of Electronic Components and Technology Conference (ECTC), 1375-1383.
  4. Xie, B., Shi, X.Q., Fan, X.J., 2007. Accelerated moisture sensitivity test methodology for stacked-die molded matrix array package, Proc of IEEE 9th Electronics Packaging Technology Conference (EPTC), 100-104. PDF
  5. Shi, X.Q., Fan, X.J, 2007. Wafer-level film selection for stacked-die chip scale packages, Proc of Electronic Components and Technology Conference (57th ECTC), 1731-1736.  PDF
  6. Xie, B., Shi, X.Q., Fan, X.J., 2007. Sensitivity investigation of substrate thickness and reflow profile on wafer level film failures in 3D chip scale packages by finite element modeling, Proc. of Electronic Components and Technology Conference (57th ECTC), 242-248. PDF
  7. Fan, X.J., 2007. Moisture Related Reliability in Electronic Packging, Electronic Component Technology Conference (ECTC) Short Course Notes.

2006

  1. Zhang, G..Q., van Driel, W.D., Fan, X.J., 2006.  Mechanics of Microelectronics, Springer.
  2. Huang, Z., Tang, J., Hu, C.,Wang, M.,Zhang, M., Liu, B., Fan, X.J., Prack, E., 2006. Moisture induced cohesive delamination in die-attach film in ultra thin stacked chip-scale package, Intel Assembly Test Tech. Journal.
  3. Sahasrabudhe, S., Raman, A., Renavikar, M., Fan, X.J., Lucero, A., Sane, S., 2006. Mechanistic reliability model for thermo-mechanically driven BLM delamination, Intel Assembly & Test Technology Journal.
  4. Fan, X.J., Pei, M., Bhatti, P.K., 2006. Effect of finite element modeling techniques on solder joint fatigue life prediction of flip-chip BGA packages, Proc. of Electronic Components and Technology Conference (ECTC), 972-980. PDF
  5. Pei, M., Fan, X.J., Bhatti, P.K., 2006. Field condition reliability assessment for SnPb and SnAgCu solder joints in power cycling including mini cycles, Proc. of Electronic Components and Technology Conference (ECTC), 899-905. PDF
  6. Bhatti, P.K., Pei, M., Fan, X.J., 2006. Reliability analysis of SnPb and SnAgCu solder joints in FC-BGA packages with thermal enabling preload, Proc. of Electronic Components and Technology Conference (ECTC), 601-606. PDF
  7. Fan, X.J., 2006. delamination/cracking mechanism study for ultra-thin stacked-die chip scale packages, Intel Conference on manufacturing Excellence (IMEC), San Diego, CA.
  8. Kuper, F.G., Fan, X.J., 2006. Reliability Practice, Chapter 2, in Mechanics of Microelectronics, Zhang, et al, Springer, 35-63.
  9. van Driel, W.D., Zhang, G.Q., Fan, X.J., 2006. Thermo-Mechanics of Integrated Circuits and Packages, Chapter 5, in Mechanics of Microelectronics, Zhang et al, Springer, 169-279.
  10. Fan, X.J., Zhang, G.Q., van Driel, W.D., Zhou, J., 2006, Characterization and Modeling of Moisture Behavior, Chapter 6, in Mechanics of Microelectronics, Zhang et al, Springer, 281-375.
  11. Prack, E., Fan, X.J., 2006. Root cause mechanisms for delamination/cracking in stack-die chip scale packages, IEEE International Symposium on Semiconductor manufacturing  (ISSM), 219-222. PDF
  12. Du, Z.Z., Wang, J.F., Fan, X.J., 2006. Direct cyclic analysis for solder joint reliability, ASME International Mechanical Engineering Congress and Exposition (IMECE2006). PDF
  13. Zhu, L., Beh, K.S., Fan, X.J., 2006. Thermal fatigue reliability modeling and analysis of FCBGA package assembly under preloaded use condition, 9th International Fatigue Congress, 2006, may 14 - 19, Atlanta, Georgia.
  14. Sahasrabudhe, S., Raman, A., Renavikar, M., Fan, X.J., Lucero, A., Sane, S., 2006. Mechanistic reliability model for thermo-mechanically driven thin film delamination in microelectronic packages, TMS2006, 135th Annual Meeting and Exposition, San Antonio, TX.
  15. Fan, X.J., 2006. Moisture Related Reliability in Electronic Packging, Electronic Component Technology Conference (ECTC) Short Course Notes.

2005 and Before

  1. Fan, X.J., Zhou, J., Zhang, G.Q., Ernst, L.J., 2005. A micromechanics based vapor pressure model in electronic packages, ASME Journal of Electronic Packaging, 127 (3), 262-267. PDF
  2. Fan, X.J., Rasier, G., Vasudevan, V.S., 2005. Effects of dwell time and ramp rate on lead-free solder joints in FCBGA packages, Proc. of Electronic Components and Technology Conference (ECTC), 901-906. PDF
  3. Fan, X.J., 2005. Moisture Related Reliability in Electronic Packging, Electronic Component Technology Conference (ECTC) Short Course Notes.
  4. Fan, X.J., Zhang, G.Q., 2004. Overview: characterization and modeling of moisture behavior of electronic packaging, Micromaterials and Nanomaterials,  3, 12-27. PDF
  5. Fan, X.J., Zhou, J., Zhang, G.Q., 2004. Multi-physics modeling in virtual prototyping of electronic packages - combined thermal, thermo-mechanical and vapor pressure modeling, Journal of Microelectronics Reliability, 44, 1967-1976. PDF
  6. van Driel, W.D., Fan, X.J., Zhang, G.Q., 2004. Foreword - special section on EuroSimE, IEEE Transactions on Components and Packaging Technologies, 27(4), 627-628. PDF
  7. van Gils, maJ., van Driel, W.D., Zhang, G.Q., Bressers, H.J.L., van Silfhout, R.B.R., Fan, X.J., Janssen, J.H.J., 2004. Virtual qualification of moisture induced failures of advanced packages, Proc of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 157-162.
  8. van Driel, W.D., Wisse, G., Chang, A.Y.L, Janssen, J.H.J., Zhang, G.Q., Ernst, L.J., Fan, X.J., 2004. Influence of material combinations on delamination failures in a cavity-down TBGA package, IEEE Transactions on Components and Packaging Technologies, 27(4), 651- 658. PDF
  9. Yang, D., Jansen, K.M.B., Wang, L.G., Ernst, L.J., Zhang, G.Q., Bressers, H.J.L., Fan, X.J., 2004. Micromechanical modeling of stress evolution induced during cure in a particle-filled electronic packaging polymer, IEEE Transactions on Components and Packaging Technologies,  27(4), 676-683. PDF
  10. Fan, X.J., Zhang, G.Q., van Driel, W.D., Ernst, L.J., 2004. Mechanism-based delamination prediction during reflow with moisture preconditioning, Proc of the International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 329 – 335.
  11. Fan, X.J., 2004. Combined thermal and thermomechanical modelling for a multi-chip QFN package with metal-core printed circuit board, Proc. of Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM ), volume 2, 377 – 382.
  12. Fan, X.J., Zhang, G.Q., van Driel, W.D., Ernst, L.J., 2003. Analytical solution for moisture-induced interface delamination in electronic packaging, Proc. of Electronic Components and Technology Conference, 733-738. PDF
  13. Fan, X.J., 2003, development, validation, and application of thermal modeling for a MCM power package, Proc. of IEEE Semiconductor Thermal Measurement and management Symposium, 144 -150. PDF
  14. Fan, X.J., Zhang, G.Q., 2002. Multi-Physics modeling in virtual prototyping of electronic packages, Proc. of 3rd International Conference on Thermal & Mechanical Simulation in Micro-Electronics (EuroSimE), 29-37.
  15. Fan, X.J., Zhang, G.Q., Ernst, L.J., 2002. A Micro-mechanics approach in polymeric material failures in microelectronic packaging, Proc. of 3rd International Conference on Thermal & Mechanical Simulation in Micro-Electronics (EuroSimE), 154-164. PDF
  16. Fan, X.J., Haque S., 2002. Emerging MOSFET packaging technologies and their thermal evaluation, Proc. of  Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), 1102 – 1108.
  17. Fan, X.J., Wang, H.B., Lim, T.B., 2001. Investigation of the underfill delamination and cracking for flip chip module during thermal cyclic loading, IEEE Transactions on Components, manufacturing and Packaging Technologies, 24(1), 84-91. PDF
  18. Fan, X.J., 2000. Modeling of vapor pressure during solder reflow for electronic packages, in Benefiting from Thermal and Mechanical Simulation in Micro-Electronics, Zhang, G.Q., Ernst, L.J., de Saint Leger, O., (eds.), Kluwer Academic Publishers, 75-92.
  19. Fan, X.J., Lim, T.B., 1999. Mechanism analysis for moisture-induced failures in IC packages, ASME International Mechanical Engineering Congress and Exposition, IMECE/EPE-14. PDF
  20. Tee, T.Y., Fan, X.J., Lim, T.B., 1999. Modeling of whole field vapor pressure during reflow for flip chip and wire-bond PGBA Packages, 1st International Workshop on Electronic materials & Packaging (EmaP), Singapore. PDF
  21. Chai, T.C., Chan, K.C., Wong, E.H., Fan, X.J., Lim, T.B., 1999. Achieving crack free package through elimination of type II failure, Proc. of Electronic Component and Technology Conference (49th ECTC), 702-707.
  22. Fan, X.J., Wang, H.B., Lim, T.B., 1999. Investigation of the underfill delamination and cracking for flip chip module during thermal cyclic loading, Proc. of Electronic Component and Technology Conference (49th ECTC), 994-1000.
  23. Zhang, H.S., Xu, J.B., Fan, X.J., 1999. In vitro culture and study on the mechanical properties of rat osteoblast, Chinese Journal of Biomedical Engineering, 18(4), 433-.
  24. Fan, X.J., Suo, J., Yang, G.T., 1998.  Mechanics of DNA, Advances in Mechanics, 28(2), 298-322.
  25. Xu, J.B., Fan, X.J., Zhang, H.S., Wu, W.Z., Yang, G.T., 1998. An application of the micropipette technique to the measurement of the mechanical properties of rat osteoblast.  Chinese Journal of Biophysics, 14,360-366.
  26. Fan, X.J., Teo, Y.C., Teo, P.S., Lim, T.B., 1998. Die cracking analysis in flip chip PBGA, Proc. of 4th International Symposium of Electronic Packaging Technology, Beijing, China.
  27. Xu, J.B., Wu, W.Z., Zhang, H.S., Fan, X.J., Yang, G.T., 1998. Theory and experiment of the mechanical properties of rat osteoblast. Journal of Taiyuan University of Technology, 29(1), 1-4.
  28. Zhang, N., Fan, X.J., 1997. Investigation of stiffness of trabeculae bone by RVE approach, Acta Mechanica Sinica, 69(2), 241-249.
  29. Shu, X., Zhang, N., Fan, X.J., 1997. Homogenization model of trabeculae bone, Chinese Journal of Biomechanics, 12(4), 212-218.
  30. Wei, D.M., Fan, X.J., 1997. Catastrophic analysis for crack growth stability in a three-point-bending specimen, Acta Mechanica Solida Sinica, 9(3), 213-219.
  31. Fan, X.J., Zhang, N., 1997. Micro-structural model study for cancellous bone. Advances in Solid Mechanics, Proceedings in Honor of the 70th Anniversary of Prof. K.C. Hwang, ed, S.W. Yu et al, Tsinghua University Press, Beijing, China, 323-351.
  32. Fan, X.J., Yang, G.T., 1997. Advances in the mechanics of organs and tissues, Proc in honor of the 40th anniversary of Chinese Society for the Theoretical and Applied Mechanics,  (ed. Zhuang Fenggan), Tsinghua Univ. Press, Beijing, China, 50-61.
  33. Fan, X.J., 1996. Homogenization theory and its applications in biomechanics, Advances in Mechanics, 26(2), 187-197.
  34. Zhang, N., Fan. X.J., 1996. Compact bone: numerical simulation of mechanical characteristics, Journal of Biomechanics, 29, 1673-1674.
  35. Fan, X.J., 1996. From organ to structure, from molecular to cell: advances in biomechanics. Chinese Mechanics towards 21st Century, ed. Yang Wei, Tsinghua Univ. Press, Beijing, China.
  36. Fan, X.J., 1995. Cell biomechanics, Advances in Mechanics, 25(2), 197-208.
  37. Fan, X.J., Zhang, S.Y., 1995. Void behavior due to internal pressure induced by temperature rise, Journal of material Science, 30, 3483-3486.
  38. Fan, X.J., Sato Y., Watanabe, K., 1995. Elasto-plastic branched analysis for an interface crack based on crack energy density, Acta Mechanica Solida Sinica, 8(2), 171-177.
  39. Fan, X.J., Watanabe, K.,1995. Three strip yield model in mixed mode fracture, International Journal of Fracture, 72(2), 183-189.
  40. Fan, X.J., Sun, J.S., Qian, J., 1995. A combination of weight function method and line spring model: surface-cracked  cylindrical shell subjected to stress gradients, International Journal of Solids and Structures, 32(20), 3037-3046.
  41. Fan, X.J., Lei, J.P., 1995. Effect of the yielding scale at warm prestressing on the behavior of crack initiation, Acta Metallurgica et materialia, 43(4), 1447-1450.
  42. Fan, X.J., 1995. Yield criterion for PMma at a bone-implant interface, Proc of The Fourth China-Japan-USA-Singapore Conference on Biomechanics, ed. GT Yang et al., International Academic Publishers, Beijing, 360-363.
  43. Fan, X.J., 1995. Some basic problems on CED concept extended to interface cracks. Microstructures and Mechanical Properties of New Engineering materials. ed. Binge Xu and masataka Tokuda, International Academic Publishers, Beijing, 107-112.
  44. Fan, X.J., Watanabe, K., 1994. Representation of plasticity at an interface crack by inclined strip yield superdislocation model, Acta Mechanica Solida Sinica, 7(3), 265-273.
  45. Wang, H., Fan, X.J., 1994. Effect of the temperature near crack tip caused by hardening and damage of the heat-work mould materials. Chinese Journal of Mechanical Engineering, 30(1), 75-81.
  46. Fan, X.J., Watanabe, K., 1994. Applicability of inclined strip yield superdislocation model to crack problems, 1st report, a study on interface crack problem, SEISAN-KENKYU, 46(3), 62-64.
  47. Fan, X.J., Watanabe, K., 1994. Applicability of inclined strip yield superdislocation model to crack problems, 2nd report, a study on mixed-mode crack problem, SEISAN-KENKYU, 46(3), 65-67.
  48. Fan, X.J., Watanabe, K., 1994. CED for inelastic interface crack, 3rd report, the dependencies of notch root radius. Proceedings of National Conference on Numerical methods in Mechanics (Japan), Sendai, Japan, 232-235.
  49. Fan, X.J., Yan, Z.D., 1993. The theorem of term-by-term differentiation of Legendre series and its application. Journal of Taiyuan University of Technology, 24(2), 43-48.
  50. Sato, Y., Fan, X.J. Watanabe, K., 1993. CED for an interface crack and its evaluation, American Society of Mechanical Engineers, Pressure Vessels and Piping Division (Publication) PVP, v 304, Fatigue and Fracture Mechanics in Pressure Vessels and Piping, 129-136.
  51. Sato, Y., Fan, X.J., Watanabe, K., 1993. CED for inelastic interface crack, 1st report, fundamental relations . Proceedings of the 71st National Conference of Japanese Society for Mechanical Engineering, Hiroshima, Japan, 438-443.
  52. Sato, Y., Fan, X.J., Watanabe, K., 1993. CED for inelastic interface crack, 2nd report, a study based on elasto-plastic FEM. Proceedings of the 71st National Conference of Japanese Society for Mechanical Engineering, 438-443, Hiroshima, Japan.
  53. Fan, X.J., 1993. Some recent advances in fracture mechanics. Journal of Taiyuan University of Technology, 24, 152-159.
  54. Fan, X.J., Yu, S.W., 1992. Temperature fields at the crack tip in a damaging medium, Z. Angew. math. Mech.,72 , 166-169.
  55. Fan, X.J., Yu, S.W., 1992, Near-tip temperature distribution for mode III stationary crack in power-hardening  materials, Acta Mechanica Solida Sinica, 5(3), 259-268.
  56. Fan, X.J., Yu, S.W., 1992. Stress intensity factor of a surface crack in a plate with non-uniform stress gradient. Journal of Applied Mechanics, 9(1), 10-15.
  57. Fan, X.J., 1992. Asymptotic analysis of temperature field at mode III crack tip in an elasto-perfectly plastic material. Journal of Taiyuan University of Technology, 23(4), 68-73.
  58. Fan, X.J., 1992. A modified Jonson-Hult damage model in crack analysis. Proceedings of the 6th National Conference on Fracture, 122-125, Hangzhou, China.
  59. Fan, X.J., 1992. Toughening analysis for warm prestressing with large scale yielding, Annual Conference for Young Scientists, China Society of Mechanics.
  60. Fan, X.J., Yu, S.W., 1991. Toughening analysis for warm prestressing, International Journal of Pressure Vessel and Piping, 48, 1-8.
  61. Fan, X.J., Yu, S.W., 1991. Thermal shock analysis for a surface-cracked plate, Engineering Fracture Mechanics, 41(2), 223-228.
  62. Fan, X.J., Yu, S.W., 1991. Toughening analysis for warm presstressing, SMiRT 11 Transactions Vol. G, G09/7.
  63. Fan, X.J., Yu, S.W., 1991. Asymptotic solutions of the transient stresses in a surface cracked hollow cylinder subjected to thermal shock, Journal of Thermal Stresses, 14(1), 19-33.
  64. Fan, X.J., Yu, S.W., 1990. Initiation Analysis of Axial Surface Crack in a Hollow Cylinder Subjected to Thermal Shock, Journal of Computational Structural Mechanics and Applications. 7(2), 7-15.
  65. Fan, X.J., Yu, S.W., Hwang, K.C., 1990. The line spring model with arbitrary loads on crack surfaces and its applications in thermal shock analysis, Acta Mechanica Sinica, 6(3), 248-255.
  66. Yan, Z.D., Fan, X.J., 1990. Axisymmetric problem with arbitrary opening angles using finite spherical layer method. Proc. 1st National Conference on the Combination Method of Analytic and Numerical Solutions, 84-89.
  67. Yan, Z.D., Fan, X.J., Zhao, Y.J., 1990. Two methods doe solving the axisymmetric problem of open spherical shell with arbitrary developing angles. Proceedings of the International Conference on Structural Engineering and Computation , Peking Univ. Press, Beijing. 303-308.
  68. Fan, X.J., 1989. Uniformity for the solutions of energy release rate. Mechanics Practice, 11(4), 61-62.
  69. Fan, X.J., Yu. S.W., 1989. A new-developed finite element code for thermal shock analysis in nuclear reactor's structures, Proceedings of the 5th National Conference on Structural Mechanics in Nuclear Reactor Technology, Chengdu, China. 23-33.
  70. Fan, X.J., Yu, S.W., 1988. Stress intensity factor under thermal shock with multi-point line spring model. Proceedings of the 5th National Conference on Structural Mechanics in Nuclear Reactor Technology, Chengdu, China. 1-6.
  71. Wang, Y.L., Fan, X.J., Lu, M.W., 1988. Analysis of thermal stresses in nuclear reactor structures, Annual Conference on Nuclear Safety.

Patents

  1. Fan, X.J., METHOD FOR PROVIDING DOUBLE-SIdeD COOLING OF LEADFRAME-BASED WIRE-BONdeD ELECTRONIC PACKAGES AND deVICE PRODUCED THEREBY
    1. US Patent Office, 10576615，2003.
    2. World Intellectual Property Organization, WO2004IB52097，2004
    3. Korea Patent Office, KR1020067007544，2006
    4. China Patent Office, CN200480030339，2005
    5. Japan Patent Office, JP2006534899，2006
  2. Fan, X.J., INTEGRATED CIRCUIT PACKAGE INCLUDING SEALED GAPS AND PREVENTION OF VAPOR INDUCED FAILURES AND METHOD OF maNUFACTURING THE SAME
    1. US Patent Office，US6773964 (B2)，US2004061127 (A1)，2004
    2. World Intellectual Property Organization，WO2004030094 (A1)，2004
    3. European Patent Office，EP1550160 (A0)，2005
    4. China Patent Office，CN1685500 (A)，2004
    5. Australia Patent Office, AU2003260878 (A1)，2003
  3. Fan, X.J., Jeff Lord and Willam Keith, THERmaL-EFFICIENT POWER CONVERTER ENCLOSURE FOR SOLAR PANELS
    1. US Patent Office，US20060124167，2006
  4. Fan, X.J., JUNCTION TEMPERATURES MEASUREMENTS IN SEMICONDUCTOR CHIP PACKAGE TECHNOLOGY
    1. US Patent Office, US 6,853,944，2006
  5. Fan, X.J., Peng Xu, LIGHT-EMITTING DIOde THERmaL maNAGEMENT SYSTEM
    1. US Patent Office, US 10562528，2004
    2. World Intellectual Property Organization, WO2005001943，2005
    3. Korea Patent Office，10200570252，2005
    4. European Patent Office，2004737085，2004
    5. China Patent Office，200480018753.X，2004
    6. Japan Patent Office，200651838，2006

Reports

  1. U.S. department of Energy (DOE) Report, Hammer Testing Findings for Solid-State Lighting Luminaires. 2013.
  2. U.S. department of Energy (DOE), LED Luminaire Lifetime: Recommendations for Testing and Reporting, Third Edition 2014.